A new method that can be used to overcome the condensation risks in radiant cooling systems and thermal comfort examinations
In this study, we propose a novel cooling dehumidifying strategy, in which a condensing panel can be hydronically connected in series with the radiant cooling system to overcome condensation risk and improve indoor thermal comfort level. Based on the concept, the sensible heat-load is primarily covered by radiant cooling panels and some amount of latent heat and sensible heat can be treated by the condensing panel, while improving indoor thermal comfort level. Since, the surface temperature of the condensing panel is lower than the dew point temperature, while the radiant surface is higher for same supply water temperatures - condensation occurs only over the condensing plate. This paper evaluates the thermal comfort performance of the proposed novel condensing panel. For these aim, a new experimental chamber was developed. General thermal comfort level and the temperature, relative humidity ratio distribution in the tested room were evaluated for 10 different experimental cases. Multiple tests were conducted by varying surface temperature of the condensing panel and initial relative humidity ratios of air in the room. The results show that proposed simple solution can improve thermal comfort level, for the places where the latent heat loads are not considerable high, and reduce the condensation risk over the radiant cooling panels.